IDC2.0-UP1S-3A Datasheet, Specs, Alternatives & ECAD | XYECONN | PartGenie

AI summary

IDC2.0-UP1S-3A product

The IDC2.0-UP1S-3A is a 3-pin, 2.0mm pitch IDC connector designed for reliable wire-to-board applications, featuring gold-plated contacts and a robust PA6T housing.

Best for

Wire-to-board connections
Compact electronic assemblies

Avoid if

High-vibration environments without strain relief
Applications requiring high-current power delivery

Check before use

Wire gauge compatibility
PCB footprint

Key specifications

Pitch: 2.0 mm
Pins: 3
Current Rating: 1.5 A

Compliance & Environment

RoHS: Yes
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

IndustrialConsumer

Datasheet

2ce3b62b5911335d14062151add7324a_2405070947_XYECONN-IDC2-0-UP1S-3A_C22392246.pdf

800 KB

CAD Models

Download ECAD models for IDC2.0-UP1S-3A: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3-pin insulation displacement connector (IDC) with a 2.0mm pitch, suitable for wire-to-board connections.