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K-DYX-005 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

K-DYX-005 product

K-DYX-005

Interconnects

MicroSIMConnectorSMDFlip-type

The HDGC K-DYX-005 is a compact 1.5mm flip-type MicroSIM connector designed for SMT assembly, suitable for mobile and consumer electronics.

Best for

  • Mobile devices
  • Consumer electronics

Avoid if

  • High-vibration environments without cover retention

Check before use

  • PCB footprint compatibility

Key specifications

Card Type
MicroSIM
Height
1.5 mm
Durability
5000 cycles

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer Electronics

Datasheet

a72c10062bbe0182d5499fa25e7861cb_2111151930_HDGC-K-DYX-005_C2919612.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for K-DYX-005: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 8-pin MicroSIM card connector with a flip-cover mechanism, designed for surface mount (SMD) applications.