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K-DYX-006 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

K-DYX-006 product

K-DYX-006

Memory Connectors

MicroSIMConnectorSMDPush-Push

The K-DYX-006 is a 1.5mm profile MicroSIM card connector with a push-push mechanism, suitable for compact SMD applications.

Best for

  • Mobile devices
  • IoT modules
  • Compact consumer electronics

Avoid if

  • High-vibration environments without additional card retention

Check before use

  • PCB footprint compatibility
  • Reflow profile

Key specifications

Card Type
MicroSIM
Height
1.5 mm
Durability
1500 cycles

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsConnectivity

Datasheet

877fcd0129d767cfc4e06e06e66178e1_2111151930_HDGC-K-DYX-006_C2919613.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for K-DYX-006: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a MicroSIM card connector manufactured by HDGC, featuring a push-push mechanism and a low 1.5mm profile.