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K-DYX-007 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

K-DYX-007 product

K-DYX-007

Interconnects

Nano SIMConnectorSMDSelf-bouncing

The HDGC K-DYX-007 is a compact, self-bouncing Nano SIM card connector with a 1.37mm profile, suitable for space-constrained SMD applications.

Best for

  • Mobile phones
  • IoT devices
  • Wearables

Avoid if

  • Applications requiring extreme vibration resistance without additional support

Check before use

  • PCB footprint compatibility

Key specifications

Height
1.37 mm
Current Rating
1.0 A
Cycles
5000

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsConnectivity

Datasheet

28d94691000cc903aab12bde2bf848b5_2111151930_HDGC-K-DYX-007_C2919614.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for K-DYX-007: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Nano SIM card connector featuring a self-bouncing mechanism, designed for surface-mount technology (SMD) applications.