M0800HI-03-GN Datasheet, Specs, Alternatives & ECAD | Dongguan Xingfei Connector Co., Ltd. | PartGenie

AI summary

M0800HI-03-GN product

The M0800HI-03-GN is a 3-position, 0.8mm pitch IDC connector from XFCN, suitable for compact wire-to-board applications.

Best for

Compact electronic assemblies
Wire-to-board signal connections

Avoid if

High-current applications exceeding 0.5A
Environments outside -25°C to +85°C

Check before use

Wire gauge compatibility (AWG #32)
Mating header series compatibility

Key specifications

Pitch: 0.8 mm
Positions: 3
Voltage Rating: 30 V
Current Rating: 0.5 A

Compliance & Environment

RoHS: -
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Connectivity

Datasheet

771bc4437d84b90c9a6176e9d15c39d9_2401101556_XFCN-M0800HI-03-GN_C509155.pdf

800 KB

CAD Models

Download ECAD models for M0800HI-03-GN: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 0.8mm pitch IDC (Insulation Displacement Connector) designed for wire-to-board connections, featuring 3 positions in a single row.