M3025V-2x6P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

M3025V-2x6P product

M3025V-2x6P

Terminals

3.00mm PitchWire-to-Board12-Pin

The M3025V-2x6P is a 12-pin, 3.00mm pitch dual-row vertical wire-to-board header from XFCN, suitable for general-purpose power and signal connections.

Best for

  • General wire-to-board connectivity
  • Power distribution in consumer electronics

Avoid if

  • High-vibration environments without strain relief
  • Applications requiring extreme temperature resistance beyond 85°C

Check before use

  • Mating terminal compatibility
  • PCB footprint layout

Key specifications

Pitch
3.00 mm
Pins
12 (2x6)
Current Rating
5 A (max)

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

CAD Models

Download ECAD models for M3025V-2x6P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3.00mm pitch, 12-pin (2x6) dual-row vertical wafer header connector used for wire-to-board applications.