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MHDM9-K AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

MHDM9-K product

MHDM9-K

D-Sub

D-SubBackshellShieldedZinc Alloy

The MHDM9-K is a 9-position, 180° shielded D-Sub backshell kit made of nickel-plated die-cast zinc alloy, suitable for robust industrial connectivity applications.

Best for

  • Industrial I/O
  • Shielded cable assemblies

Avoid if

  • Applications requiring non-metallic or lightweight plastic housings

Check before use

  • Cable diameter compatibility

Key specifications

Positions
9
Material
Die Cast Zinc Alloy
Operating Temp
-40°C to +120°C

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
REACH Unaffected
MSL
1 (Unlimited)
ECCN
EAR99
HTSUS
8538.90.8180

Application

IndustrialConnectivity

CAD Models

Download ECAD models for MHDM9-K: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 9-way D-Sub backshell kit designed for shielded, 180-degree cable entry.