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MHDTZK25-RA-HI-K AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

MHDTZK25-RA-HI-K product

MHDTZK25-RA-HI-K

D-Sub

D-SubBackshellShieldedZinc Alloy

The MHDTZK25-RA-HI-K is a 25-way D-Sub backshell kit made of nickel-plated die-cast zinc alloy, suitable for shielded interconnect applications.

Best for

  • Shielded D-Sub cable assemblies
  • Industrial connectivity

Avoid if

  • Non-standard cable diameters outside the 4-9mm range

Check before use

  • Cable outer diameter compatibility

Key specifications

Positions
25
Material
Die-Cast Zinc Alloy
Operating Temp
-40°C to +120°C

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
REACH Unaffected
MSL
1 (Unlimited)
ECCN
EAR99
HTSUS
8538.90.8180

Application

IndustrialConnectivity

Datasheet

MHDTZK25-RA-HI-K-MH-Connectors-datasheet-504373.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for MHDTZK25-RA-HI-K: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 25-position D-Sub backshell kit designed for shielding and strain relief.