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MICRO SIM 6+1P H1.5 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

MICRO SIM 6+1P H1.5 product

MICRO SIM 6+1P H1.5

Interconnects

MicroSIMConnectorSMDPush-Push

The SHOU HAN MICRO SIM 6+1P H1.5 is a reliable, low-profile push-push MicroSIM connector suitable for mobile and IoT applications.

Best for

  • Mobile phones
  • IoT modules
  • Portable communication devices

Avoid if

  • Applications requiring extreme vibration resistance beyond standard specs

Check before use

  • PCB footprint compatibility
  • Reflow soldering profile

Key specifications

Connector Type
MicroSIM
Mounting
SMD
Height
1.5 mm
Durability
1500 cycles

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsConnectivity

CAD Models

Download ECAD models for MICRO SIM 6+1P H1.5: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 6+1 pin MicroSIM card connector featuring a push-push (self-bouncing) mechanism, designed for surface mount (SMD) assembly.