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MICRO SIM 6P H1.35 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

MICRO SIM 6P H1.35 product

MICRO SIM 6P H1.35

Interconnects

Micro SIMConnectorSMDPush-Push

The MICRO SIM 6P H1.35 is a 6-pin Micro SIM card connector featuring a push-push ejection mechanism and a low-profile 1.35mm height, suitable for compact SMD-mounted applications.

Best for

  • Mobile devices
  • IoT modules
  • Compact communication hardware

Avoid if

  • Applications requiring extreme vibration resistance beyond standard specs
  • Environments exceeding +70°C

Check before use

  • PCB footprint compatibility
  • Reflow soldering profile requirements

Key specifications

Connector Type
Micro SIM
Height
1.35 mm
Mechanism
Push-Push

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsConnectivity Modules

Datasheet

d14e134477e37f4f5acd42e6315178d3_SHOU HAN(首韩)&MICRO SIM 6P H1.35.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for MICRO SIM 6P H1.35: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 6-pin Micro SIM card connector designed for surface-mount technology (SMD) applications, utilizing a push-push (self-bouncing) mechanism for card insertion and ejection.