MLG0603P2N2CT000 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

MLG0603P2N2CT000 product

MLG0603P2N2CT000

Chokes

Inductor0201High-QRF

The TDK MLG0603P2N2CT000 is a high-Q, 2.2nH multilayer ceramic inductor in a 0201 package, ideal for high-frequency mobile communication circuits.

Best for

  • RF matching networks
  • Mobile communication modules
  • Bluetooth/W-LAN circuits

Avoid if

  • High-power applications exceeding 600mA
  • Designs requiring large physical inductors

Check before use

  • PCB layout for high-frequency performance
  • Reflow soldering profile

Key specifications

Inductance
2.2 nH
Tolerance
±0.2 nH
Rated Current
600 mA
DCR
0.10 Ω

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
REACH Compliant
MSL
-
ECCN
-
HTSUS
-

Application

Mobile CommunicationRF Modules

Datasheet

CAD Models

Download ECAD models for MLG0603P2N2CT000: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a high-frequency multilayer ceramic chip inductor from TDK, specifically designed for high-Q applications in mobile communication devices.