MLP2012S3R3MT0S1 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

MLP2012S3R3MT0S1 product

MLP2012S3R3MT0S1

Chokes

Power InductorMultilayerSMDTDK

The TDK MLP2012S3R3MT0S1 is a 3.3 µH multilayer power inductor in a 2012 (0805) package, optimized for power supply circuits in compact electronic devices.

Best for

  • Smartphones
  • Tablets
  • Portable electronics
  • Power supply modules

Avoid if

  • Applications requiring currents significantly higher than 900 mA
  • High-precision RF filtering where specific Q-factor requirements exist

Check before use

  • DC bias characteristics
  • Thermal management

Key specifications

Inductance
3.3 µH
Rated Current
900 mA
DC Resistance
0.19 Ω

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
Compliant
MSL
-
ECCN
-
HTSUS
-

Application

PowerConsumer Electronics

CAD Models

Download ECAD models for MLP2012S3R3MT0S1: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a multilayer ferrite power inductor from TDK's MLP series, designed for power supply circuits in mobile and compact devices.