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MX250-3.5-03P-B-GY01-Cu-A AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

MX250-3.5-03P-B-GY01-Cu-A product

MX250-3.5-03P-B-GY01-Cu-A

Interconnects

Terminal Block3.5mm PitchWire-to-Board

The MX250-3.5-03P-B-GY01-Cu-A is a 3-position, 3.5mm pitch wire-to-board terminal block designed for reliable PCB connections.

Best for

  • General industrial wire-to-board connections

Avoid if

  • Applications requiring high-vibration resistance without additional strain relief

Check before use

  • PCB footprint layout

Key specifications

Pitch
3.5 mm
Positions
3
Rating
300V / 8A

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialGeneral

Datasheet

a27d57d27633dad88087161e2c79bfff_2309150914_MAX-MX250-3-5-03P-B-GY01-Cu-A_C7470117.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for MX250-3.5-03P-B-GY01-Cu-A: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It features a 3.5mm pitch, 3 positions, and is rated for 300V/8A. It uses PA66 housing and tin-plated phosphor bronze contacts.