NDST-CP120-T100-4T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T100-4T product

NDST-CP120-T100-4T

Thermal Pads

Thermal PadSilicone1.0 W/m.K

The NDST-CP120 is a 4.0mm thick thermal conductive silicone pad with 1.0 W/m.K conductivity, suitable for general heat dissipation applications.

Best for

  • General heat dissipation
  • Gap filling in electronic assemblies

Avoid if

  • Applications requiring high thermal conductivity (>5 W/m.K)

Check before use

  • Gap tolerance and compression requirements

Key specifications

Thermal Conductivity
1.0 W/m.K
Thickness
4.0 mm
Flame Rating
UL94 V-0

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General

CAD Models

Download ECAD models for NDST-CP120-T100-4T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a gray-white, soft thermal conductive silicone sheet designed for effective heat transfer between electronic components and heat sinks.