NDST-CP120-T150-0.5T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T150-0.5T product

NDST-CP120-T150-0.5T

Thermal Pads

Thermal PadSilicone1.5W/m.K

The NDST-CP120-T150-0.5T is a soft, dark gray thermal conductive silicone pad measuring 200x400x0.5mm, offering 1.5W/m.K thermal conductivity.

Best for

  • General heat dissipation
  • Electronic component cooling

Avoid if

  • Applications requiring extremely high thermal conductivity (>5 W/m.K)

Check before use

  • Surface compatibility and required compression force

Key specifications

Thermal Conductivity
1.5 W/m.K
Thickness
0.5 mm
Operating Temp
-50°C to 150°C

Compliance & Environment

RoHS
YES
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

CAD Models

Download ECAD models for NDST-CP120-T150-0.5T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
Get Files
PCB Footprint
Land pattern for PCB layout
Get Files
3D Model
STEP file for mechanical design
Get Files
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a thermal conductive silicone sheet designed to reduce interfacial thermal resistance between electronic components and heat sinks.