NDST-CP120-T150-5T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T150-5T product

NDST-CP120-T150-5T

Thermal Pads

Thermal PadSilicone1.5 W/m·K

The NDST-CP120-T150-5T is a 5mm thick, dark gray thermal conductive silicone sheet designed for effective heat dissipation in electronic assemblies.

Best for

  • Thermal management in electronic devices
  • Gap filling between components and heat sinks

Avoid if

  • Applications requiring high thermal conductivity (>5 W/m·K)
  • Environments exceeding 150°C

Check before use

  • Surface cleanliness for optimal adhesion
  • Required compression force for the 5mm thickness

Key specifications

Thermal Conductivity
1.5 W/m·K
Thickness
5.0 mm
Flame Rating
UL94 V-0

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

CAD Models

Download ECAD models for NDST-CP120-T150-5T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a thermal conductive silicone sheet with a thickness of 5.0 mm, designed to reduce interfacial thermal resistance between electronic components and heat sinks.