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NDST-CP120-T150-T4 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T150-T4 product

NDST-CP120-T150-T4

Thermal Pads

Thermal PadSilicone1.5W/m.K

The NDST-CP120-T150-T4 is a 200x200x4mm thermal conductive silicone pad with 1.5W/m.K thermal conductivity, suitable for heat dissipation in electronic assemblies.

Best for

  • Thermal interface management
  • Gap filling in electronics

Avoid if

  • High-pressure applications requiring extreme thermal conductivity

Check before use

  • Gap thickness requirements

Key specifications

Thermal Conductivity
1.5 W/m.K
Thickness
4.0 mm
Flame Rating
UL94 V-0

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Thermal Management

Datasheet

26d2ec4db9501a5b0985bcc32d3bbc93_2206141116_NDST-NDST-CP120-T150-T4_C2980251.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for NDST-CP120-T150-T4: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a dark gray thermal conductive silicone pad designed for efficient heat transfer between electronic components and heat sinks.