NDST-CP120-T300-0.5T Datasheet, Specs, Alternatives & ECAD | NDST | PartGenie

AI summary

NDST-CP120-T300-0.5T product

The NDST-CP120-T300-0.5T is a high-performance thermal conductive silicone pad with 3.0 W/m·K conductivity, suitable for effective heat management in electronic assemblies.

Best for

CPU/GPU cooling
Power supply modules
LED lighting heat dissipation

Avoid if

Applications requiring high structural load-bearing capacity

Check before use

Surface cleanliness of mating parts

Key specifications

Thermal Conductivity: 3.0 W/m·K
Thickness: 0.5 mm
Flame Rating: UL94 V-0

Compliance & Environment

RoHS: Yes
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Industrial CoolingConsumer Electronics

Datasheet

b08a0aaafb15ee86b228b74c9f333746_2108071730_NDST-NDST-CP120-T300-0-5T_C2837484.pdf

800 KB

CAD Models

Download ECAD models for NDST-CP120-T300-0.5T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a blue, soft thermal conductive silicone pad designed to bridge gaps between heat-generating electronic components and heat sinks.