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NDST-CP120-T300-1.5T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T300-1.5T product

NDST-CP120-T300-1.5T

Thermal Pads

Thermal PadSilicone3.0 W/m·K

The NDST-CP120-T300-1.5T is a 3.0 W/m·K thermal conductive silicone pad measuring 200x400x1.5mm, suitable for high-performance heat dissipation.

Best for

  • Heat dissipation in electronic assemblies

Avoid if

  • Applications requiring high structural load-bearing

Check before use

  • Surface cleanliness of components for optimal adhesion

Key specifications

Thermal Conductivity
3.0 W/m·K
Thickness
1.5 mm
Fire Rating
UL94 V-0

Compliance & Environment

RoHS
YES
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialPower

Datasheet

eaa3c351f310cc3a1373957ffb4be0cf_2108071730_NDST-NDST-CP120-T300-1-5T_C2837505.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for NDST-CP120-T300-1.5T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a blue, soft thermal conductive silicone pad designed to reduce interfacial thermal resistance between electronic components and heat sinks.