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NDST-CP120-T300-1T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T300-1T product

NDST-CP120-T300-1T

Thermal Pads

Thermal PadSilicone3.0 W/m·K

The NDST-CP120-T300-1T is a 1.0mm thick, blue thermal conductive silicone pad with 3.0 W/m·K thermal conductivity, suitable for heat dissipation in electronic assemblies.

Best for

  • Thermal management in electronic devices
  • Gap filling between components and heat sinks

Avoid if

  • Applications requiring high mechanical strength or structural support

Check before use

  • Ensure the pad thickness matches the gap between the component and the heat sink

Key specifications

Thermal Conductivity
3.0 W/m·K
Thickness
1.0 mm
Flame Rating
UL94 V-0

Compliance & Environment

RoHS
YES
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer Electronics

Datasheet

b397d911b28ff4d2ce7c74920ccfc396_2108071730_NDST-NDST-CP120-T300-1T_C2837504.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for NDST-CP120-T300-1T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a high-purity, soft thermal conductive silicone pad designed to reduce interfacial thermal resistance between electronic components and heat sinks.