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NDST-CP120-T300-2T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T300-2T product

NDST-CP120-T300-2T

Thermal Pads

Thermal PadSilicone3.0 W/m.k

The NDST-CP120-T300-2T is a 3.0W/m.k thermal conductive silicone pad measuring 200x400x2.0mm, suitable for high-performance heat dissipation.

Best for

  • Thermal management in power electronics
  • Heat dissipation for CPUs/GPUs

Avoid if

  • Applications requiring high structural rigidity or non-compressible materials

Check before use

  • Ensure the 2.0mm thickness provides the correct compression for your specific gap

Key specifications

Thermal Conductivity
3.0 W/m.k
Thickness
2.0 mm
Flame Rating
UL94 V-0

Compliance & Environment

RoHS
YES
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Power ElectronicsConsumer Electronics

Datasheet

845445a8a18260784f913529b0c6b5f7_2108071730_NDST-NDST-CP120-T300-2T_C2837506.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for NDST-CP120-T300-2T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a blue, soft thermal conductive silicone pad designed to reduce interfacial thermal resistance between electronic components and heat sinks.