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NDST-CP120-T300-3T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T300-3T product

NDST-CP120-T300-3T

Thermal Pads

Thermal PadSilicone3.0 W/m·K

The NDST-CP120-T300-3T is a 3.0mm thick blue thermal conductive silicone pad with a thermal conductivity of 3.0 W/m·K, suitable for heat dissipation in electronic assemblies.

Best for

  • General heat dissipation
  • Electronic component cooling

Avoid if

  • Applications requiring double-sided adhesion
  • Extremely high-stress mechanical environments

Check before use

  • Surface cleanliness of components
  • Compression requirements

Key specifications

Thermal Conductivity
3.0 W/m·K
Thickness
3.0 mm
Operating Temp
-50°C to 150°C

Compliance & Environment

RoHS
YES
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialGeneral

Datasheet

58ed9a8f15f91baa776135203a681c16_2108071730_NDST-NDST-CP120-T300-3T_C2837507.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for NDST-CP120-T300-3T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a high-purity silicone-based thermal conductive pad designed to reduce interfacial thermal resistance between electronic components and heat sinks.