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NDST-CP120-T300-4T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T300-4T product

NDST-CP120-T300-4T

Thermal Pads

Thermal PadSilicone3.0 W/m·K

The NDST-CP120-T300-4T is a 3.0 W/m·K thermal conductive silicone pad measuring 200x400x4.0 mm, designed for effective heat dissipation in electronic assemblies.

Best for

  • Heat dissipation in electronic assemblies
  • Filling gaps between components and heat sinks

Avoid if

  • Applications requiring double-sided adhesion
  • Environments exceeding 150°C

Check before use

  • Ensure the 4.0 mm thickness is appropriate for the gap size to avoid excessive stress on components.

Key specifications

Thermal Conductivity
3.0 W/m·K
Thickness
4.0 mm
Flame Rating
UL94 V-0

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Industrial ElectronicsConsumer Electronics

Datasheet

48a6d4c3913ad7102db17ee219f281f0_2108071730_NDST-NDST-CP120-T300-4T_C2837508.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for NDST-CP120-T300-4T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a blue, high-purity silicone thermal pad used to reduce interfacial thermal resistance between electronic components and heat sinks.