ProjectsPricingInsights

NDST-CP120-T300-T1 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T300-T1 product

NDST-CP120-T300-T1

Sheets

Thermal PadSilicone3.0 W/m.K

The NDST-CP120-T300-T1 is a 200x200x1.0mm thermal conductive silicone pad with 3.0 W/m.K conductivity, suitable for general electronics cooling.

Best for

  • General electronics cooling
  • Bridging gaps between components and heat sinks

Avoid if

  • Applications requiring high structural strength or non-compressible materials

Check before use

  • Thermal interface gap requirements
  • Surface compatibility

Key specifications

Thermal Conductivity
3.0 W/m.K
Thickness
1.0 mm
Flame Rating
UL94 V-0

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Cooling

Datasheet

e1ce794f08aface178b2b82fb4b7790c_2206141116_NDST-NDST-CP120-T300-T1_C2980253.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for NDST-CP120-T300-T1: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
Get Files
PCB Footprint
Land pattern for PCB layout
Get Files
3D Model
STEP file for mechanical design
Get Files
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Generate library

Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a thermally conductive silicone interface pad designed to bridge gaps between heat-generating electronic components and heat sinks.