NDST-CP120-T300-T2 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

NDST-CP120-T300-T2 product

NDST-CP120-T300-T2

Thermal Pads

Thermal PadSilicone3.0 W/m.K

The NDST-CP120-T300-T2 is a 200x200x2.0mm blue thermal silicone pad offering 3.0 W/m.K thermal conductivity and UL94 V-0 flame retardancy.

Best for

  • Thermal interface between heat sources and heat sinks
  • Applications requiring electrical insulation and vibration damping

Avoid if

  • Applications requiring non-compressible thermal interface materials

Check before use

  • Verify the required thickness for your specific mechanical assembly gap.

Key specifications

Thermal Conductivity
3.0 W/m.K
Thickness
2.0 mm
Flammability
UL94 V-0

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Thermal Management

CAD Models

Download ECAD models for NDST-CP120-T300-T2: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a high-performance thermal conductive silicone pad designed for heat dissipation in electronic assemblies.