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P2016-06P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

P2016-06P product

P2016-06P

Interconnects

2.00mmCrimp Housing6-Position

The P2016-06P is a 6-position, 2.00mm pitch wire-to-board crimp housing featuring a locking buckle for secure connections.

Best for

  • Wire-to-board signal connections
  • Consumer electronics

Avoid if

  • High-vibration environments without strain relief
  • High-current power applications

Check before use

  • Crimp terminal compatibility
  • Mating header dimensions

Key specifications

Pitch
2.00 mm
Positions
6
Material
Nylon UL94V-0

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

ConnectivityGeneral

Datasheet

67e65645f7b4f371ede64fd78d87e91b_2304140030_XFCN-P2016-06P_C705201.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for P2016-06P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.00mm pitch, 6-position wire-to-board connector housing manufactured by XFCN, designed for secure crimp-style connections.