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P2016-10P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

P2016-10P product

P2016-10P

Interconnects

2.00mm PitchCrimp Housing10-Position

The P2016-10P is a 10-position, 2.00mm pitch wire-to-board crimp housing featuring a locking buckle for secure connections.

Best for

  • Wire-to-board applications
  • Compact electronic assemblies

Avoid if

  • High-vibration environments without strain relief
  • Non-standard pitch requirements

Check before use

  • Mating header compatibility
  • Terminal crimp specifications

Key specifications

Pitch
2.00 mm
Positions
10
Material
Nylon UL94V-0

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Connectivity

Datasheet

88ab9f42ed1cd81ace80276691640ed0_2304140030_XFCN-P2016-10P_C705205.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for P2016-10P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 10-position, single-row crimp housing with a 2.00mm pitch, manufactured by XFCN.