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PADP-14V-1-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PADP-14V-1-S product

PADP-14V-1-S

Interconnects

JST2.0mm PitchCrimp Housing

The PADP-14V-1-S is a 14-position, 2.0mm pitch dual-row crimp housing from JST's PAD series, suitable for high-density wire-to-board connections.

Best for

  • High-density wire-to-board applications

Avoid if

  • Applications requiring different pitch or higher current ratings than 3A

Check before use

  • Compatibility with specific wire gauges (AWG #28 to #22)

Key specifications

Positions
14
Pitch
2.0 mm
Material
PA 66

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer Electronics

Datasheet

PADP-14V-1-S-JST-datasheet-121620.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PADP-14V-1-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 14-circuit dual-row housing for JST's 2.0mm pitch PAD series crimp-style connectors.