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PADP-16V-1-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PADP-16V-1-S product

PADP-16V-1-S

Interconnects

JSTPAD SeriesCrimp Housing2.0mm Pitch

The PADP-16V-1-S is a 16-position, 2.0mm pitch dual-row crimp housing from JST's PAD series, designed for reliable wire-to-board connectivity.

Best for

  • Wire-to-board applications
  • High-density PCB layouts

Avoid if

  • High-vibration environments without proper strain relief

Check before use

  • Terminal crimp specifications

Key specifications

Positions
16
Pitch
2.0 mm
Material
PA 66, UL94V-0

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer

Datasheet

PADP-16V-1-S-JST-datasheet-121620.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PADP-16V-1-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 16-circuit dual-row receptacle housing for JST's 2.0mm pitch PAD connector system.