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PADP-20V-1-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PADP-20V-1-S product

PADP-20V-1-S

Rectangular Connectors - Housings

JSTPAD Series2.0mm PitchCrimp Housing

The PADP-20V-1-S is a 20-position, 2.0 mm pitch dual-row crimp housing from JST's PAD series, designed for reliable wire-to-board connections.

Best for

  • Wire-to-board applications
  • High-density PCB layouts

Avoid if

  • High-vibration environments without proper strain relief

Check before use

  • Contact crimping specifications

Key specifications

Positions
20
Pitch
2.0 mm
Rows
2

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer

Datasheet

PADP-20V-1-S-JST-datasheet-121620.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PADP-20V-1-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 20-position dual-row crimp housing for 2.0 mm pitch wire-to-board connectors.