PAP-02V-R Datasheet, Specs, Alternatives & ECAD | JST | PartGenie

AI summary

PAP-02V-R product

The PAP-02V-R is a 2-position, 2.0mm pitch wire-to-board crimp housing from JST's PA series, featuring a secure locking mechanism and UL94V-0 rated PA66 construction.

Best for

Wire-to-board harness assemblies

Avoid if

High-temperature environments exceeding 85°C

Check before use

Terminal compatibility

Key specifications

Pitch: 2.0 mm
Positions: 2
Material: PA66

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

General

Datasheet

f39bb61324871fc9fa1f883176d3dd1d_2005151007_JST-PAP-02V-R_C495676.pdf

800 KB

CAD Models

Download ECAD models for PAP-02V-R: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2-position connector housing for the JST PA series, designed for 2.0mm pitch wire-to-board applications.