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PAP-02V-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PAP-02V-S product

PAP-02V-S

Interconnects

JSTPA Series2.0mm PitchConnector Housing

The JST PAP-02V-S is a 2-position, 2.0mm pitch wire-to-board crimp housing designed for secure, reliable connections in wire harness assemblies.

Best for

  • Wire-to-board harness assemblies
  • Compact electronic devices

Avoid if

  • High-current applications exceeding 3A
  • Environments requiring extreme vibration resistance without secondary retainers

Check before use

  • Crimp contact compatibility
  • Mating header series

Key specifications

Pitch
2.0 mm
Positions
2
Material
PA 66 (UL94V-0)

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

Datasheet

PAP-02V-S-JST-datasheet-122075.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PAP-02V-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2-position connector housing from JST's PA series, featuring a 2.0mm pitch for wire-to-board applications.