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PAP-03V-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PAP-03V-S product

PAP-03V-S

Interconnects

JSTPA Series2.0mm PitchCrimp Housing

The PAP-03V-S is a 3-position, 2.0mm pitch crimp housing from JST's PA series, designed for secure wire-to-board connections.

Best for

  • Wire-to-board harness assemblies

Avoid if

  • High-vibration environments without proper strain relief

Check before use

  • Terminal crimp specifications

Key specifications

Pitch
2.0 mm
Positions
3
Material
PA 66, UL94V-0

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

Datasheet

PAP-03V-S-JST-datasheet-122075.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PAP-03V-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3-position, 2.0mm pitch connector housing for the JST PA series, used for wire-to-board applications.