PAP-05V-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PAP-05V-S product

PAP-05V-S

Interconnects

JSTPA Series2.0mm PitchConnector Housing

The PAP-05V-S is a 5-position, 2.0mm pitch wire-to-board crimp housing from JST's PA series, designed for secure, reliable connections in wire harness assemblies.

Best for

  • Wire-to-board harness assemblies
  • Compact electronic devices

Avoid if

  • High-current applications exceeding 3A

Check before use

  • Terminal crimp specifications

Key specifications

Pitch
2.0 mm
Positions
5
Series
PA

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer

CAD Models

Download ECAD models for PAP-05V-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 5-position, 2.0mm pitch wire-to-board connector housing from the JST PA series.