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PAP-06V-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PAP-06V-S product

PAP-06V-S

Interconnects

Connector Housing2.0mm PitchJST PA Series

The JST PAP-06V-S is a 6-position, 2.0mm pitch wire-to-board connector housing designed for secure, reliable connections in wire harness assemblies.

Best for

  • Wire-to-board connections
  • Wire harness assemblies

Avoid if

  • High-vibration environments without proper strain relief
  • Applications requiring non-crimp termination

Check before use

  • Ensure correct crimp tool and contact selection

Key specifications

Positions
6
Pitch
2.0 mm
Material
PA 66

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General

Datasheet

PAP-06V-S-JST-datasheet-122075.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PAP-06V-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 6-position, 2.0mm pitch crimp-style connector housing from the JST PA series, used for wire-to-board applications.