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PAP-13V-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PAP-13V-S product

PAP-13V-S

Rectangular Connectors - Housings

JSTConnector Housing2.0mm Pitch

The PAP-13V-S is a 13-position, 2.0mm pitch wire-to-board connector housing from JST's PA series, designed for secure crimp-style connections.

Best for

  • Wire-to-board applications
  • Wire harness assemblies

Avoid if

  • High-vibration environments without proper strain relief

Check before use

  • Verify wire gauge compatibility with the crimp contacts

Key specifications

Positions
13
Pitch
2.0 mm
Material
PA 66, UL94V-0

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

Datasheet

PAP-13V-S-JST-datasheet-1807.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PAP-13V-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 13-circuit connector housing for the JST PA series, featuring a 2.0mm pitch and a secure locking mechanism.