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PHDR-30VS AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PHDR-30VS product

PHDR-30VS

Interconnects

ConnectorHousingJSTPHD Series

The JST PHDR-30VS is a 30-position, 2.0mm pitch, double-row wire-to-board crimp housing designed for high-density, low-profile applications.

Best for

  • High-density wire-to-board connections
  • Low-profile electronic assemblies

Avoid if

  • High-power applications exceeding 3A
  • Environments requiring extreme temperature resistance beyond -25°C to +85°C

Check before use

  • Terminal compatibility
  • PCB header mating

Key specifications

Positions
30
Pitch
2.0 mm
Material
PA 66

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

Datasheet

PHDR-30VS-JST-datasheet-12518494.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PHDR-30VS: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 30-position, 2.0mm pitch, double-row wire-to-board receptacle housing from the JST PHD series.