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PUDP-26V-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PUDP-26V-S product

PUDP-26V-S

Interconnects

JSTPUD2.0mm PitchCrimp Housing

The PUDP-26V-S is a 26-position, 2.0mm pitch double-row crimp housing from JST's PUD series, designed for secure board-to-wire connections.

Best for

  • Compact board-to-wire applications
  • Vibration-prone environments

Avoid if

  • High-current applications exceeding 3A
  • Wire gauges outside the AWG #28-#22 range

Check before use

  • Ensure the correct crimp terminals are selected for the wire size.

Key specifications

Positions
26
Pitch
2.0 mm
Series
PUD

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer Electronics

Datasheet

PUDP-26V-S-JST-datasheet-12395095.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PUDP-26V-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 26-circuit, 2.0mm pitch double-row receptacle housing used in JST's PUD connector system for board-to-wire applications.