ProjectsPricingInsights

PUDP-30V-S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

PUDP-30V-S product

PUDP-30V-S

Interconnects

Connector Housing2.0mm PitchJST PUD

The PUDP-30V-S is a 30-position, 2.0mm pitch double-row crimp-style connector housing from JST, designed for secure board-to-wire connections.

Best for

  • Board-to-wire connections
  • Vibration-prone environments

Avoid if

  • High-current applications exceeding 3A

Check before use

  • Terminal compatibility
  • Mating header series

Key specifications

Positions
30
Pitch
2.0 mm
Rows
2

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer

Datasheet

PUDP-30V-S-JST-datasheet-12395095.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for PUDP-30V-S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
Get Files
PCB Footprint
Land pattern for PCB layout
Get Files
3D Model
STEP file for mechanical design
Get Files
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Generate library

Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 30-position, 2.0mm pitch, double-row receptacle housing used in board-to-wire connector systems.