SEAF8-50-05.0-S-04-3 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

SEAF8-50-05.0-S-04-3 product

SEAF8-50-05.0-S-04-3

Rectangular Connectors

High-SpeedBoard-to-Board0.80 mm Pitch

The SEAF8-50-05.0-S-04-3 is a high-density, high-speed 0.80 mm pitch array socket from Samtec, featuring 200 pins across 4 rows and a 5.0 mm body height.

Best for

  • High-speed data transmission
  • Compact board-to-board interconnects

Avoid if

  • Low-density requirements
  • Applications requiring through-hole mounting

Check before use

  • Mating terminal height
  • PCB footprint compatibility

Key specifications

Pitch
0.80 mm
Pin Count
200
Body Height
5.0 mm

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
nan
MSL
nan
ECCN
nan
HTSUS
nan

Application

High-Speed DataIndustrial

CAD Models

Download ECAD models for SEAF8-50-05.0-S-04-3: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 200-pin high-speed board-to-board socket connector with a 0.80 mm pitch, designed for high-density applications.