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SEAM8-50-S02.0-S-04-3 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

SEAM8-50-S02.0-S-04-3 product

SEAM8-50-S02.0-S-04-3

Rectangular Connectors

High-SpeedMezzanine0.80 mm Pitch

The SEAM8-50-S02.0-S-04-3 is a high-density, high-speed open-pin-field array connector from Samtec, designed for mezzanine board-to-board applications with 0.80 mm pitch and 200 positions.

Best for

  • High-speed mezzanine board-to-board interconnects
  • High-density PCB designs

Avoid if

  • Low-density or low-speed applications where cost is the primary driver

Check before use

  • Mated stack height requirements
  • PCB footprint compatibility

Key specifications

Positions
200
Pitch
0.80 mm
Rows
4
Performance
56 Gbps PAM4

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
-
MSL
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040

Application

ConnectivityIndustrial

Datasheet

11dcf0b7cf40d207f18e42659caba79b_2404071808_Samtec-SEAM8-50-S02-0-S-04-3_C3653432.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for SEAM8-50-S02.0-S-04-3: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 200-position male high-density array connector in the Samtec SEAM8 series, featuring a 0.80 mm pitch and surface mount termination.