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TFSZ06051987-3315A4 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TFSZ06051987-3315A4 product

TFSZ06051987-3315A4

RF/IF and RFID

BalunRFTDKThin-Film

The TFSZ06051987-3315A4 is a thin-film balun from TDK, optimized for Band1-Band3 Rx applications (1805-2170MHz) in a compact 0202 package.

Best for

  • RF signal balancing
  • Band1-Band3 Rx applications

Avoid if

  • Applications outside the 1805-2170MHz range

Check before use

  • Reflow soldering profile compatibility

Key specifications

Frequency
1805-2170 MHz
Insertion Loss
0.42 dB
Package
0202 (0.65x0.5mm)

Compliance & Environment

RoHS
RoHS Compliance
REACH
-
MSL
1
ECCN
-
HTSUS
-

Application

RF Communications

Datasheet

b90aa8e552a8ed5c083b6d4730fdd5a1_2005181102_TDK-TFSZ06051987-3315A4_C340677.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TFSZ06051987-3315A4: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a thin-film balun component manufactured by TDK, specifically designed for RF signal conversion in the 1805-2170MHz frequency band.