It is an 8GB eMMC managed flash memory module that integrates flash memory and a controller in a single 153-ball BGA package.
THGBMUG6C1LBAIL AI Analysis:
Datasheet, Specs, Alternatives & ECAD
AI summary
Key specifications
- Capacity
- 8 GB
- Interface
- eMMC 5.1
- Package
- 153-ball BGA
- Temp Range
- -25 °C to 85 °C
Compliance & Environment
- RoHS
- -
- REACH
- -
- MSL
- -
- ECCN
- -
- HTSUS
- -
Application
Consumer ElectronicsIoT
Datasheet
CAD Models
Download ECAD models for THGBMUG6C1LBAIL: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.
EDA Symbol
Schematic symbol for your EDA tool
PCB Footprint
Land pattern for PCB layout
3D Model
STEP file for mechanical design
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Where to Buy
Real-time and catalog pricing from verified distributors
Alternative components
Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.
