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TO-220有孔 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TO-220有孔 product

TO-220有孔

Thermal Management

Thermal InterfaceSilicone PadTO-220

The TO-220 thermal silicone pad is a standard interface material for heat dissipation in power electronics.

Best for

  • TO-220 power transistors
  • Voltage regulators

Avoid if

  • Applications requiring high thermal conductivity (>3W/m.K)

Check before use

  • Mounting pressure and surface flatness

Key specifications

Thermal Conductivity
1.0 W/m.K
Thickness
0.3 mm
Flame Rating
UL94V-2

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Power ManagementIndustrial

Datasheet

0f259f6da355da1e9c0154257d471337_2303141230_NDST-TO-220_C2826364.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TO-220有孔: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is used to provide electrical insulation and thermal coupling between a TO-220 component and a heatsink.