TO-28 Datasheet, Specs, Alternatives & ECAD | NDST | PartGenie

AI summary

TO-28 product

The TO-28 is a gray silicone thermal pad measuring 48mm x 28mm x 0.3mm, offering 1.0 W/m·K thermal conductivity and 4kV dielectric strength.

Best for

General thermal management
Power component insulation

Avoid if

Applications requiring high-pressure thermal grease or phase-change materials

Check before use

Surface flatness of the mating components

Key specifications

Thermal Conductivity: 1.0 W/m·K
Thickness: 0.3 mm
Breakdown Voltage: 4 kV
Operating Temp: -40°C to +200°C

Compliance & Environment

RoHS: Yes
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Power ElectronicsGeneral Thermal Management

Datasheet

772e7272c8348c1fc287f0b7248bd644_2303141230_NDST-TO-28_C2826446.pdf

800 KB

CAD Models

Download ECAD models for TO-28: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a silicone-based thermal interface material designed to improve heat transfer between electronic components and heat sinks.