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TO-30 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TO-30 product

TO-30

Thermal Pads

Thermal PadSiliconeHeat Dissipation

The NDST TO-30 is a 0.3mm thick gray silicone thermal pad designed for efficient heat transfer and electrical insulation in electronic assemblies.

Best for

  • General heat dissipation
  • Electrical insulation

Avoid if

  • Applications requiring extremely high thermal conductivity (>5 W/m·K)

Check before use

  • Surface flatness of the mating components

Key specifications

Thermal Conductivity
1.0 W/m·K
Thickness
0.3 mm
Flame Rating
94V-2
Breakdown Voltage
4 kV

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Power ElectronicsIndustrial

Datasheet

a7d96b6b09fb0bf0cf6f9452c4b5add2_2303141230_NDST-TO-30_C2826445.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TO-30: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a silicone-based thermal interface material (thermal pad) used to improve heat transfer between heat-generating components and heat sinks.