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TO-3P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TO-3P product

TO-3P

Component

Thermal PadSiliconeTO-3P

The TO-3P silicone thermal pad is a gray, 0.3mm thick interface material designed for efficient heat transfer in TO-3P packaged power components.

Best for

  • TO-3P power components
  • General thermal management

Avoid if

  • Applications requiring extremely high thermal conductivity (>5W/m.K)

Check before use

  • Surface cleanliness
  • Mounting pressure

Key specifications

Thermal Conductivity
1.0 W/m.K
Thickness
0.3 mm
Breakdown Voltage
4 kV

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Power Electronics

Datasheet

fa9ae437039b018a2399373122a26869_2303141230_NDST-TO-3P_C2826365.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TO-3P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a silicone-based thermal interface material specifically sized for TO-3P power transistors and diodes.