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TO-3P有孔 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TO-3P有孔 product

TO-3P有孔

Sheets

Thermal PadSiliconeTO-3P

The NDST TO-3P thermal pad is a gray silicone-based interface material designed for efficient heat dissipation in power electronics.

Best for

  • Power transistors
  • TO-3P package cooling

Avoid if

  • Applications requiring extremely high thermal conductivity (>5 W/m·K)

Check before use

  • Surface cleanliness
  • Mounting pressure

Key specifications

Thermal Conductivity
1.0 W/m·K
Thickness
0.3 mm
Operating Temp
-40°C to +200°C

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Power ElectronicsIndustrial Cooling

Datasheet

df401987d808c6f1b1d5ca21afd8cdfa_2303141230_NDST-TO-3P_C2826365.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TO-3P有孔: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is used to provide electrical insulation and thermal coupling between a TO-3P component and a heatsink.