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TO-50 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TO-50 product

TO-50

Sheets

Thermal PadSilicone1.0 W/m.K

The TO-50 is a gray silicone thermal interface pad measuring 50.5mm x 29mm x 0.3mm, designed for efficient heat transfer in electronic assemblies.

Best for

  • General electronics cooling
  • Thermal interface for power components

Avoid if

  • Applications requiring extremely high thermal conductivity (>5 W/m.K)

Check before use

  • Surface flatness of the mating components

Key specifications

Thermal Conductivity
1.0 W/m.K
Thickness
0.3 mm
Operating Temp
-40°C to +200°C

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General ElectronicsPower Management

Datasheet

f6b5e77b58abe9e4a36627a1015f5450_2303141230_NDST-TO-50_C2826447.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for TO-50: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

The TO-50 is a silicone-based thermal interface material (TIM) sheet used to improve heat transfer between heat-generating components and heatsinks.