TPAL0263F10R0K9 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

TPAL0263F10R0K9 product

TPAL0263F10R0K9

Chip Resistor - Surface Mount

10 Ω±1%35 WTO-263thick filmnon-inductivepower resistorlow-temperature reflow

TPAL0263F10R0K9 is a 10 Ω, ±1% TO-263 thick-film power resistor intended for high-power PCB mounting with thermal connection through its flange.

Best for

  • Current sensing and power dissipation circuits
  • RC snubbers and energy absorption
  • Industrial power equipment and motor-drive circuits

Avoid if

  • Applications without adequate flange cooling
  • Designs requiring more than 2.25 W without a heatsink
  • Applications needing an explicitly documented lifecycle status

Check before use

  • Heatsink thermal resistance and contact interface
  • Flange temperature under worst-case load
  • 500 V maximum working-voltage limit
  • Low-temperature reflow profile compatibility

Key specifications

Resistance
10 Ω
Tolerance
±1%
Power with heatsink
35 W at flange ≤25 °C
Power without heatsink
2.25 W
TCR
±100 ppm/°C
Maximum working voltage
500 V
Thermal resistance
3.0 °C/W

Compliance & Environment

RoHS
RoHS
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Industrial power equipmentMotor control and drive circuitsPower supplies and RC snubbersAutomotive electronics

Datasheet

CAD Models

Download ECAD models for TPAL0263F10R0K9: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

TPAL0263F10R0K9 is a RESI planar non-inductive thick-film power resistor in a TO-263 package. It has a 10 Ω nominal resistance, ±1% tolerance, and ±100 ppm/°C temperature coefficient.